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CT48 Memory SiP NAND + DDR2 (9x9mm) application note-CT48 Memory SiP NAND + DDR2 (9x9mm) application note (2011.11.30)
CT48 Memory SiP NAND + DDR2 (9x9mm) application note |
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CT48 Memory SiP NAND + DDR2 (10x13mm) application note-CT48 Memory SiP NAND + DDR2 (10x13mm) application note (2011.11.30)
CT48 Memory SiP NAND + DDR2 (10x13mm) application note |
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CT83 Memory SiP DDR2 Stack (10.5x13.5mm) application note-CT83 Memory SiP DDR2 Stack (10.5x13.5mm) application note (2011.11.30)
CT83 Memory SiP DDR2 Stack (10.5x13.5mm) application note |
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CT49 Memory SiP NAND + DDR3 (2011.06.17)
CT49 Memory SiP is a Multi Chip Package Memory (MCP) that integrated NAND Flash and DDR3 SDRAM by advanced SiP (System-in-a-Package) technology. CT49 Memory SiP offers space saving advantage that could miniaturize your portable device |
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CT84 Memory SiP DDR3 Stack (2011.06.17)
CT84 Memory SiP is a Multi Chip Package Memory (MCP) that integrated DDR3 SDRAM- stacked by advanced SiP (System-in-a-Package) technology. CT84 Memory SiP offers space saving advantage that could miniaturize your portable device |
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CT92 Memory SiP Mobile DDR Stack (2011.06.17)
CT92 Memory SiP is a Multi Chip Package Memory (MCP) that integrated Mobile DDR SDRAM-stacked by advanced SiP (System-in-a-Package) technology. CT92 Memory SiP offers space saving advantage that could miniaturize your portable device |
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Pad(MID) SiP Turnkey Solution (2011.06.16)
Android OS, 7-inch Touch LCM, WiFi 802.11 b/g/n, Full HD codec, USB 2.0, HDMI 1.3a, Up 5000mAh Battery, High integrated by SiP(System in Package) components: GPS, BT, (Option) WiFi, DDR2 SDRAM stack, Height: 9.85mm; Weight: 3 |
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巨景获得第19届「台湾精品奖」肯定 (2011.01.04)
巨景科技（ChipSiP）近日宣布，CT48整合多芯片内存（1Gb NAND+1Gb DDR2 SDRAM）和CT83四堆栈内存两款Memory SiP产品荣获第19届「台湾精品奖」殊荣。
巨景表示，CT48是全球第一款以闪存（NAND Flash）加上动态存取内存（DDR2）的产品，其应用定位于数字相机、数字摄影机等高规格、多功能数字产品 |
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巨景科技4Gb Memory SiP产品进入量产 (2009.11.30)
巨景科技推出CT83 Memory SiP（4Gb DDRⅡ; x32bit），于第三季初导入知名日系相机厂商的高速薄型相机，此新款相机已于十一月底正式发售。数字相机轻薄且兼具多功能的市场趋势，让日系相机厂在高速连拍与高倍数变焦机种的设计上，也开始走轻薄体积 |
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富士通微电子推出耐热125°C低功耗内存SiP (2009.05.25)
富士通微电子宣布推出两款新消费性FCRAM内存芯片，为首颗可承受125°C高温运作范围的内存，并可支持DDR SDRAM接口。此两款新FCRAM产品开始提供样本，包括512Mbit规格的MB81EDS516545芯片产品、以及256Mbit规格的MB81EDS256545芯片产品 |
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鉅景 (2008.03.11)
着眼于科技随身化的潮流，巨景科技于2002年以”Chip of SiP”构建元件微型化的品牌核心价值，以全方位系统解决方案，运用封装技术，创造最小、最易于整合之记忆体、逻辑、无线通讯的SiP元件，充分满足未来轻薄短小的随身化需求 |
