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CT48 Memory SiP NAND + DDR2 (9x9mm) application note-CT48 Memory SiP NAND + DDR2 (9x9mm) application note (2011.11.30)
CT48 Memory SiP NAND + DDR2 (9x9mm) application note |
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CT48 Memory SiP NAND + DDR2 (10x13mm) application note-CT48 Memory SiP NAND + DDR2 (10x13mm) application note (2011.11.30)
CT48 Memory SiP NAND + DDR2 (10x13mm) application note |
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CT83 Memory SiP DDR2 Stack (10.5x13.5mm) application note-CT83 Memory SiP DDR2 Stack (10.5x13.5mm) application note (2011.11.30)
CT83 Memory SiP DDR2 Stack (10.5x13.5mm) application note |
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CT49 Memory SiP NAND + DDR3 (2011.06.17)
CT49 Memory SiP is a Multi Chip Package Memory (MCP) that integrated NAND Flash and DDR3 SDRAM by advanced SiP (System-in-a-Package) technology. CT49 Memory SiP offers space saving advantage that could miniaturize your portable device |
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CT84 Memory SiP DDR3 Stack (2011.06.17)
CT84 Memory SiP is a Multi Chip Package Memory (MCP) that integrated DDR3 SDRAM- stacked by advanced SiP (System-in-a-Package) technology. CT84 Memory SiP offers space saving advantage that could miniaturize your portable device |
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CT92 Memory SiP Mobile DDR Stack (2011.06.17)
CT92 Memory SiP is a Multi Chip Package Memory (MCP) that integrated Mobile DDR SDRAM-stacked by advanced SiP (System-in-a-Package) technology. CT92 Memory SiP offers space saving advantage that could miniaturize your portable device |
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Pad(MID) SiP Turnkey Solution (2011.06.16)
Android OS, 7-inch Touch LCM, WiFi 802.11 b/g/n, Full HD codec, USB 2.0, HDMI 1.3a, Up 5000mAh Battery, High integrated by SiP(System in Package) components: GPS, BT, (Option) WiFi, DDR2 SDRAM stack, Height: 9.85mm; Weight: 3 |
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鉅景獲得第19屆「台灣精品獎」肯定 (2011.01.04)
鉅景科技（ChipSiP）近日宣佈，CT48整合多晶片記憶體（1Gb NAND+1Gb DDR2 SDRAM）和CT83四堆疊記憶體兩款Memory SiP產品榮獲第19屆「台灣精品獎」殊榮。
鉅景表示，CT48是全球第一款以快閃記憶體（NAND Flash）加上動態存取記憶體（DDR2）的產品，其應用定位於數位相機、數位攝影機等高規格、多功能數位產品 |
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鉅景科技4Gb Memory SiP產品進入量產 (2009.11.30)
鉅景科技推出CT83 Memory SiP（4Gb DDRⅡ; x32bit），於第三季初導入知名日系相機廠商的高速薄型相機，此新款相機已於十一月底正式發售。數位相機輕薄且兼具多功能的市場趨勢，讓日系相機廠在高速連拍與高倍數變焦機種的設計上，也開始走輕薄體積 |
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富士通微電子推出耐熱125°C低功耗記憶體SiP (2009.05.25)
富士通微電子宣布推出兩款新消費性FCRAM記憶體晶片，為首顆可承受125°C高溫運作範圍的記憶體，並可支援DDR SDRAM介面。此兩款新FCRAM產品開始提供樣本，包括512Mbit規格的MB81EDS516545晶片產品、以及256Mbit規格的MB81EDS256545晶片產品 |
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鉅景 (2008.03.11)
著眼於科技隨身化的潮流，鉅景科技於2002年以”Chip of SiP”構建元件微型化的品牌核心價值，以全方位系統解決方案，運用封裝技術，創造最小、最易於整合之記憶體、邏輯、無線通訊的SiP元件，充分滿足未來輕薄短小的隨身化需求 |
