据工商时报报导，IC制造后段之半导体封装测试厂，至今仍受限政府政策而未能赴大陆设厂投资；面对半导体市场全球化竞争愈趋剧烈，包括日月光、硅品等封测厂已因为未在大陆拥有营运据点，开始面临竞争对手抢单压力。

The report pointed out that the continent is huge inroads into the semiconductor business opportunities in the domestic market, a number of international IDM industry, including Intel, AMD, Infineon, Samsung and other early establishment of packaging and testing plant in mainland China, and professional packaging and testing foundry Amkor (Amkor ), Kim Peng (ChipPAC), the new Section beta (STATS), also has set up production bases in China, but ranked the world's second-largest and third largest IC packaging and testing plant in Taiwan IC packaging and testing giant ASE and SPIL, because of Taiwan government political considerations, has yet to get permission to set up factories in mainland China can.

虽然日月光及硅品已在大陆设立办公室，由全球化布局来看，建立生产据点才真正具有国际竞争力，因此二家封测厂至今仍希望政府快点开放，如此才能争取到全球半导体封测生意。否则在全球性竞争下，上游客户势必会将订单转至在大陆拥有营运据点的封测厂。

业者还指出，现在看来政府仍在拚明年选举，将封测厂申请赴大陆投资的申请案押下不审，封测厂可说是有苦说不出。日月光及硅品表示，政府至今未能开放限制，所以现在只能眼睁睁看着竞争对手扩大在大陆的营运据点，只是全球性竞争愈趋激烈，目前只能希望政府快点开放，以免未来订单流向竞争对手。